Lead Expert – Hybrid Bonding, CMP & Advanced Packaging Metrology
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About this role
About Nearfield InstrumentsNearfield Instruments (NFI) is a fast-growing, high-tech scale-up.
This is a short preview. Read the full description on Himalayas before you apply.
- Semiconductor-Engineering
- Metrology
- Process-Engineering
- Advanced-Packaging-Engineering
- Technology-Leadership
- Senior-Packaging-Engineer
- Metrology-Specialist
- Packaging-Integration-Engineer
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