Product Specialist - Flip Chip/Wire Bond

About this role

Process-Oriented Product Specialist who understands semiconductor packaging and bonding processes Key skills: • Thermal Compression Bonding (TCB) • Die Attach / Die Bonding • Wire Bonding • Flip Chip • Advanced Packaging (SiP, WLCSP, BGA, QFN) • Semiconductor Process Engineering The role involves pr

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• Information Technology
• Callable Bond
• CHIP-8
• SIP
• Packaging Design