Senior Packaging Engineer (Advanced Semiconductor Packaging)
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Senior Packaging Engineer (Advanced Semiconductor Packaging) · Singapore
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About this role
Key Responsibilities · Package Architecture & Design: Define and develop semiconductor package solutions (e.g., Flip-Chip, Wirebond, 2.5D/3D, Chiplets, CoWoS, FOWLP, SiP) from concept to mass production. · Evaluate package architectures, interconnect strategies, substrate stack-ups, and material sel
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- Engineering
- Collaborate With Engineers
- Npi
- Cost Management
- HVM
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