Process Engineer – Flip Chip Bonding Process

About this role

Job Summary: We are seeking a motivated and hands-on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day-to-day engineering su

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• Engineering
• Liaising with cross functional teams
• Microsoft PowerPoint
• Lead Management
• Semiconductor Industry