Application / Process Engineer - Die Bond Tools
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Application / Process Engineer - Die Bond Tools · Singapore
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About this role
Company Overview: Capcon Limited Ltd. is a leading provider of high-performance equipment and innovative solutions for the advanced semiconductor assembly and packaging industry. In response to increasing market demand for next-generation packaging technologies, Capcon delivers cutting-edge solution
This is a short preview. Read the full description on MyCareersFuture before you apply.
- Engineering
- Troubleshooting
- Customer Support
- Semiconductor Industry
- Root Cause Analysis
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