Senior Research Engineer II, fan-in/fan-out wafer-level pkg, 2.5D interposers, Adv Pkg, IME

About this role

IME's Advanced Packaging Programme is looking for a passionate Engineer to drive prototyping and small-volume manufacturing activities using state-of-the-art packaging platforms such as fan-in/fan-out wafer-level packaging, 2.5D interposers, and W2W/C2W 3D integration. The successful candidate will

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• Sciences / Laboratory / R&D
• Electronics Packaging
• Analytical Approach
• Teamwork
• Packaging Solutions