Packaging Engineer- Flip Chip

Volantis Semiconductor, Inc.Hybrid Remote/SF Bay Area/Austin/BostonFull-timePosted
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About this role

We're seeking experienced engineers to contribute to flip chip package development and assembly processes for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This spans bump metallurgy, substrate integration, reflow and underfill processes, reliability, failure analysis, and cros

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