R&D Singulation/Dicing Process Engineer

About this role

About the role Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging. Drive process readiness, yield improvement, robustness, and customer-specific technical solu

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• Engineering
• Liaising with cross functional teams
• Feasibility Studies
• JMP
• Leadership

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