Engineer - Test Process (WLCSP)

About this role

Responsibilities Support production operations across Taping, Backgrind (BG), Wafer Mounting, Laser Marking, Laser Grooving, and Dicing to ensure stable manufacturing output. Lead new device introductions by driving recipe qualifications, data collection, and recipe optimization. Troubleshoot proces

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• Engineering
• Standard Operating Procedures
• Technical Audit
• Lead Qualification
• Engineering Documentation

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