R&D Process Engineer (Die-to-Wafer)

About this role

About the role Develop, optimize, and qualify Die-to-Wafer (D2W) processes, including Flipchip and Underfill, for advanced semiconductor packaging applications. Support process readiness, yield improvement, process robustness, and customer-specific technical solutions from development through NPI. E

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• Engineering
• JMP
• Optimization
• FMEA
• 4d

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