Senior Research Engineer I, Adv Pkg, IME

About this role

Process integration development for high density multi-chip fan-out wafer level packaging for various applications such as AI/ HPC, Co-package Optics, Power devices etc. Drive the development of new capabilities such as fine pitch RDL, micro bumping, multi-layer RDL, polymer damascene etc required f

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• Sciences / Laboratory / R&D
• Reliability Analysis
• Materials Qualification
• Design of Experiments
• Process Integration

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